H10D 48/075
Reduction of the copper oxide or treatment of the oxide layer
Official title: {Reduction of the copper oxide or treatment of the oxide layer}
H10D48/075 (Reduction of the copper oxide or treatment of the oxide layer) appears on 6 US grants and 7 published applications in this corpus.
Search patents in H10D- Granted patents
- 6
- Published applications
- 7
- Assignees
- 5
- Inventors
- 17
- Latest grant
- 26 Apr 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2015 | 1 | 3 |
| 2016 | 2 | 2 |
| 2017 | 2 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
By publication year.
Recent patents
- Field-effect transistor with a total control of the electrical conductivity on its channel26 Apr 2022US 11,316,017 B2Luxembourg Institute of Science and Technology (List)
- Fin field effect transistor including a strained epitaxial semiconductor shell18 Jul 2017US 9,711,416 B2International Business Machines Corporation
- Fin field effect transistor including a strained epitaxial semiconductor shell18 Jul 2017US 9,711,417 B2International Business Machines Corporation
- Fin field effect transistor including a strained epitaxial semiconductor shell12 Jul 2016US 9,391,171 B2International Business Machines Corporation
- Method of forming copper sulfide film for reducing copper oxidization and loss10 May 2016US 9,337,036 B2Macronix International Co., Ltd.
- Field-effect transistor with a total control of the electrical conductivity on its channel20 Aug 2020US 2020/0266277 A1Luxembourg Institute of Science and Technology (List)
- Method for planarizing wafer surface28 May 2020US 2020/0168452 A1Shanghai Simgui Technology Co., Ltd.
- Fin field effect transistor including a strained epitaxial semiconductor shell3 Nov 2016US 2016/0322264 A1International Business Machines Corporation
- Fin field effect transistor including a strained epitaxial semiconductor shell3 Nov 2016US 2016/0322500 A1International Business Machines Corporation
- Method of Forming Copper Sulfide Film for Reducing Cu Oxidization and Loss30 Jul 2015US 2015/0214054 A1Macronix International Co., Ltd.
Most cited
By later US patents