H05K 9/0028
With retainers or specific soldering features
Official title: {with retainers or specific soldering features}
H05K9/0028 (With retainers or specific soldering features) appears on 122 US grants and 152 published applications in this corpus.
Search patents in H05K- Granted patents
- 122
- Published applications
- 152
- Assignees
- 112
- Inventors
- 410
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 2 |
| 2002 | 6 | 6 |
| 2003 | 3 | 7 |
| 2004 | 5 | 5 |
| 2005 | 1 | 4 |
| 2006 | 2 | 1 |
| 2007 | 3 | 2 |
| 2008 | 3 | 3 |
| 2009 | 0 | 5 |
| 2010 | 1 | 4 |
| 2011 | 0 | 3 |
| 2012 | 2 | 4 |
| 2013 | 2 | 11 |
| 2014 | 4 | 7 |
| 2015 | 6 | 10 |
| 2016 | 8 | 5 |
| 2017 | 6 | 11 |
| 2018 | 8 | 8 |
| 2019 | 5 | 11 |
| 2020 | 9 | 5 |
| 2021 | 7 | 12 |
| 2022 | 7 | 8 |
| 2023 | 6 | 3 |
| 2024 | 5 | 5 |
| 2025 | 5 | 4 |
| 2026 | 1 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High speed grid array module13 Jan 2026US 12,526,969 B2Intel Corporation
- Solderless or groundless electromagnetic shielding in electronic devices5 Aug 2025US 12,382,575 B2Intel Corporation
- Component shielding10 Jun 2025US 12,328,856 B2Google Inc.
- Radiation shield and groove in support structure20 May 2025US 12,309,984 B2Intel Corporation
- Shielding cover and circuit board assembly25 Mar 2025US 12,262,518 B2Inventec Corporation
- Radio-frequency/electromagnetic shielding for system-in-package10 Sep 2026US 2026/0271252 A1Meta Platforms Technologies, LLC
- Electronic device comprising shield can13 Aug 2026US 2026/0239589 A1Samsung Electronics Co., Ltd.
- Vehicle control device6 Aug 2026US 2026/0231382 A1Astemo, Ltd.
- Electronic device with electromagnetic shielding9 Jul 2026US 2026/0197933 A1Arcadyan Technology Corporation
- Circuit board, circuit board assembly, and electronic device15 Jan 2026US 2026/0020143 A1Honor Device Co., Ltd.
Most cited
By later US patents
- Circuit board RF shielding189US 6,239,359 B1Lucent Technologies Inc. · 2001
- Circuit board assembly120US 5,400,949 ANokia Mobile Phones Ltd. · 1995
- EMI shielding enclosures86US 6,090,728 A3M Innovative Properties Company · 2000
- EMI shielding enclosures75US 6,485,595 B13M Innovative Properties Company · 2002
- Method for providing electromagnetic shielding of an electrical circuit58US 5,428,508 AMotorola, Inc. · 1995