EMI shielding enclosures
Assignee3M Innovative Properties Company
InventorsDonald M. Yenni, Jr., Jose P. de Souza, Mark G. Baker
Life of this patent
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Abstract
An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.
Claims4
A method for forming an EMI shielding enclosure around an electronic assembly, comprising the steps of:
- (a) providing an electronic assembly, having a ground plane including a conductive trace;
- (b) providing a thermoformed shielding cover having a contact edge, said shielding cover further comprising:
- a non-porous carrier sheet;
- a fibrous metal mat having an outer-surface and a contact surface, said contact surface adjacent said carrier sheet, said metal mat comprising low melting metal fibers that melt during thermoforming of said shielding cover;
- and
- a resin fiber-coat applied to diffuse through said fibrous metal mat toward said non-porous carrier sheet to insulate said metal fibers, said resin fiber-coat extending less than 0.15 mm beyond said metal fibers at said outer surface of said metal mat;
- (c) aligning said contact edge with said conductive trace;
- and
- (d) adhering said contact edge against said conductive trace to form an electrical connection between said edge and said trace.
Dependencies are inferred from the claim text.