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US 6,090,728 AGranted
EMI shielding enclosures
Assignee3M Innovative Properties Company
InventorsDonald M. Yenni, Jr., Jose P. de Souza, Mark G. Baker
Life of this patent
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Abstract
An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.
Claims11
An EMI shielding enclosure for an electronic assembly, comprising:
- a ground plane;
- and
- a shielding cover, formed by thermoforming a composite sheet, said cover comprising:
- a non-porous carrier sheet;
- a fibrous metal mat having an outer surface and a contact surface, said contact surface adjacent said carrier sheet, said metal mat comprising low melting metal fibers that melt during thermoforming of said shielding cover;
- a fiber-coat to insulate said metal fibers by substantially surrounding said fibers, said fiber-coat overlying said metal fibers at said outer surface of said mat by less than 0.15 mm, said fiber-coat substantially extending through said mat to said non-porous carrier sheet;
- and
- a contact edge to form an electrical connection to said ground plane, said electrical connection made by adhesion of said contact edge against said ground plane, at temperatures up to about 200.degree. C., said cover essentially free from spheroidal protrusions.
5 more elements
Dependencies are inferred from the claim text.