H05K 7/20781
Within cabinets for removing heat from server blades
Official title: {within cabinets for removing heat from server blades}
H05K7/20781 (Within cabinets for removing heat from server blades) appears on 868 US grants and 1,307 published applications in this corpus.
Search patents in H05K- Granted patents
- 868
- Published applications
- 1,307
- Assignees
- 276
- Inventors
- 1,861
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 3 |
| 2003 | 2 | 1 |
| 2004 | 2 | 3 |
| 2005 | 2 | 5 |
| 2006 | 4 | 8 |
| 2007 | 2 | 10 |
| 2008 | 7 | 9 |
| 2009 | 10 | 16 |
| 2010 | 4 | 13 |
| 2011 | 11 | 12 |
| 2012 | 13 | 30 |
| 2013 | 18 | 35 |
| 2014 | 21 | 39 |
| 2015 | 27 | 36 |
| 2016 | 39 | 41 |
| 2017 | 34 | 53 |
| 2018 | 42 | 51 |
| 2019 | 59 | 62 |
| 2020 | 55 | 49 |
| 2021 | 65 | 73 |
| 2022 | 59 | 137 |
| 2023 | 77 | 146 |
| 2024 | 120 | 132 |
| 2025 | 117 | 169 |
| 2026 | 76 | 174 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Immersion cooling system6 Oct 2026US 12,757,352 B2Wiwynn Corporation
- Fluid immersion cooling assembly29 Sep 2026US 12,750,974 B2Cgg Services SAS
- Server rack for electronic components29 Sep 2026US 12,750,984 B2Aptiv Technologies AG
- Self-aligning connector for liquid cooling of a computing device29 Sep 2026US 12,750,985 B2Quanta Computer Inc.
- Computing system with external disconnects22 Sep 2026US 12,745,373 B2AMD Design, LLC
- Cooling and energy recovery system for data center server computers8 Oct 2026US 2026/0313838 A1
- Integrated router modular design with multi-function configurations8 Oct 2026US 2026/0313850 A1Cisco Technology, Inc.
- Apparatus, system, and methods for modular liquid-cooled component rack with hot-swap capability8 Oct 2026US 2026/0313860 A1Iceotope Group Limited
- Fluid cooling system for a fluid cooled server system1 Oct 2026US 2026/0304690 A1Prysmian S P A.
- Two-phase flow manifold and cooling apparatus including the two-phase flow manifold24 Sep 2026US 2026/0287280 A1HRL Laboratories, LLC
Most cited
By later US patents
- Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation145US 6,896,612 B1Sun Microsystems, Inc. · 2005
- Liquid cooling system for a rack-mount server system145US 7,318,322 B2Hitachi, Ltd. · 2008
- Electronic equipment129US 6,807,056 B2Hitachi, Ltd. · 2004
- Immersion cooled high density electronic assembly122US 4,590,538 ACray Research, Inc. · 1986
- Liquid-based cooling apparatus for an electronics rack99US 7,450,385 B1International Business Machines Corporation · 2008