Server rack for electronic components

A server rack system for receiving and coupling one or more electronic components to a vehicle system, the server rack system comprising:

• a housing configured to receive the one or more electronic components;
• a heat-conducting structural component;
• an active cooling system defined by a cold plate coupled to a cooling system such that a coolant circulates between the cold plate and the cooling system, the cooling system defining a heat sink;
• at least one passively cooled electronic component of the one or more electronic components defining a heat source;
• and
• a passive cooling system configured to provide a heat transfer from the at least one passively cooled electronic component to the cold plate by heat conduction via the heat-conducting structural component, wherein:
• the cold plate is located spaced apart from the at least one passively cooled electronic component,
• the heat-conducting structural component extends between the at least one passively cooled electronic component and the cold plate and is thermally coupled to each,
• the heat sink includes the heat-conducting structural component, and
• the heat-conducting structural component includes heat conducting portions configured to provide heat conduction and heat transfer for hybrid cooling.

A server rack system for receiving and coupling one or more electronic components to a vehicle system, the server rack system comprising:

• a housing configured to receive the one or more electronic components;
• a heat-conducting structural component;
• an active cooling system defined by a cold plate coupled to a cooling system such that a coolant circulates between the cold plate and the cooling system, the cooling system defining a heat sink;
• at least one passively cooled electronic component of the one or more electronic components defining a heat source;
• a passive cooling system configured to provide a heat transfer from the at least one passively cooled electronic component to the cold plate by heat conduction via the heat-conducting structural component, wherein the cold plate is located spaced apart from the at least one passively cooled electronic component, and the heat-conducting structural component extends between the at least one passively cooled electronic component and the cold plate and is thermally coupled to each;
• and
• a thermal interface material (TIM) at each respective thermal interface between corresponding contact surfaces of (i) the heat-conducting structural component and the heat source and (ii) the heat-conducting structural component and the heat sink.