Immersion cooled high density electronic assembly

A liquid immersion cooled electronic assembly, comprising:

• a liquid coolant container;
• a plurality of stacks of spaced circuit boards;
• means positioning said stacks witin said liquid coolant container in a pattern with stacks generally adjacent other stacks but spaced apart therefrom, the spaces between stacks forming coolant flow columns;
• means for supplying coolant flow to alternate ones of said columns to form coolant supply columns, said means for supplying coolant including elongate distribution manifolds positioned within said supply columns, said manifolds having a plurality of outlet holes along the length thereof to provide a substantially uniform coolant flow to circuit boards at all positions in said stacks;
• and
• means for removing coolant from others of said coolant columns to form coolant removal columns so that coolant supplied on one side of a stack flows between said spaced circuit boards therein to the other side thereof where it is removed to thereby establish coolant circulation flow across said circuit boards to cool the components thereon.

A liquid immersion cooled electronic assembly, comprising:

• a liquid coolant container;
• a plurality of vertical stacks of closely spaced circuit modules, each of said modules comprising a plurality of horizontally spaced circuit boards;
• means positioning said stacks adjacent one another in an at least partial radial pattern within said container with first ends of the stacks adjacent one another and opposite ends diverging from one another, said stacks forming sector-shaped columns therebetween;
• connection means attached to said first ends of said modules for providing signal interconnection between modules of the stacks;
• means for supplying coolant to alternate ones of said columns;
• and
• means for removing coolant from the others of said columns so that coolant supplied on one side of a stack flows between said spaced circuit boards therein to the other side thereof where it is removed to establish circulation of coolant across said circuit boards to cool circuit components thereon, said means for removing coolant including aplurality of vertical standpipes positioned in the coolant removal columns and means for removing coolant from said container through said standpipes.