H05K 7/20763
Liquid cooling without phase change
Official title: {Liquid cooling without phase change}
H05K7/20763 (Liquid cooling without phase change) appears on 1,897 US grants and 2,903 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,897
- Published applications
- 2,903
- Assignees
- 508
- Inventors
- 3,566
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 5 | 5 |
| 2003 | 2 | 1 |
| 2004 | 7 | 8 |
| 2005 | 7 | 24 |
| 2006 | 13 | 21 |
| 2007 | 14 | 33 |
| 2008 | 26 | 43 |
| 2009 | 32 | 37 |
| 2010 | 22 | 44 |
| 2011 | 34 | 40 |
| 2012 | 31 | 63 |
| 2013 | 34 | 90 |
| 2014 | 55 | 114 |
| 2015 | 81 | 84 |
| 2016 | 100 | 101 |
| 2017 | 78 | 95 |
| 2018 | 89 | 112 |
| 2019 | 119 | 133 |
| 2020 | 124 | 116 |
| 2021 | 143 | 144 |
| 2022 | 110 | 243 |
| 2023 | 149 | 257 |
| 2024 | 211 | 307 |
| 2025 | 240 | 362 |
| 2026 | 164 | 426 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Connector, connector assembly, liquid cooled plate, and liquid cooled server6 Oct 2026US 12,753,979 B2Bitmain Technologies Inc.
- Immersion cooling system6 Oct 2026US 12,757,352 B2Wiwynn Corporation
- Data center cooling system using one or more cooling loops6 Oct 2026US 12,757,358 B1NVIDIA Corporation
- Fluid immersion cooling assembly29 Sep 2026US 12,750,974 B2Cgg Services SAS
- Systems and methods for server level cooling29 Sep 2026US 12,750,982 B2Advanced Micro Devices, Inc.
- Tank assembly8 Oct 2026US 2026/0309171 A1
- Servicing system for server cassettes8 Oct 2026US 2026/0313823 A1
- Liquid-Cooling Cabinet and Structural Layout Method Therefor, and Electronic Device8 Oct 2026US 2026/0313830 A1China Mobile Communications Group Co., Ltd.
- Bidirectional thermal dissipation for enhanced system management8 Oct 2026US 2026/0313833 A1Dell Products L. P.
- Two-stage lever system for a server tray in a server rack8 Oct 2026US 2026/0313834 A1Dell Products L. P.
Most cited
By later US patents
- Method and system for cooling electronics racks using pre-cooled air345US 6,819,563 B1International Business Machines Corporation · 2004
- Data center cooling system275US 6,374,627 B12002
- Data center cooling system250US 6,859,366 B2American Power Conversion Corporation · 2005
- Hybird cooling system for electronic components245US 5,285,347 ADigital Equipment Corporation · 1994
- Air-cooled heat generating device airflow control system212US 7,315,448 B1Hewlett-Packard Development Company, L. P. · 2008