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US 12,750,982 B2Granted
Systems and methods for server level cooling
AssigneeAdvanced Micro Devices, Inc.
InventorsGirish Anant Kini, Ahmed Mohamed Abou-Alfotouh, Shardul Suresh Adkar, Ethan Cruz, Salvador D. Jimenez, III, Mark Steinke, Edgar Stone
Life of this patent
Estimating the term…
Abstract
A method for server level cooling can include providing a printed circuit board and attaching a cooling system to the printed circuit board. The cooling system can be configured for placement thereon of two or more expansion cards having back side power delivery components. Various other methods, systems, and computer-readable media are also disclosed.
Claims20
An apparatus, comprising:
- a first printed circuit board configured to support two or more expansion cards;
- and
- a first cooling element directly attached to the first printed circuit board, wherein:
- the first cooling element has a surface sized for placement thereon of the two or more expansion cards in a side by side arrangement, the two or more expansion cards each having a second printed circuit board with one or more back side power delivery components situated thereon, each of the one or more back side power delivery components on a side of the second printed circuit board facing the first cooling element;
- and
- the first cooling element is configured to provide cooling to each of the one or more back side power delivery components of the two or more expansion cards placed thereon.
3 more elements
A system, comprising:
- a universal base board configured to support two or more expansion cards;
- a cooling element directly attached to the universal base board;
- and
- the two or more expansion cards each having a printed circuit board with one or more back side power delivery components on a face of the printed circuit board facing the cooling element, the two or more expansion cards placed on a surface of the cooling element in a side by side arrangement with a thermal interface material positioned between the cooling element and each of the one or more back side power delivery components, wherein the cooling element is configured to provide cooling to each of the one or more back side power delivery components.
1 more element
A method comprising:
- providing a first printed circuit board configured to support two or more expansion cards;
- providing the two or more expansion cards each having a second printed circuit board with one or more back side power delivery components on a face of the second printed circuit board facing the first printed circuit board;
- attaching a cooling element directly to the first printed circuit board, wherein the cooling element has a surface configured to provide cooling to the one or more back side power delivery components of any of the two or more expansion cards placed thereon;
- and
- placing the two or more expansion cards in a side by side arrangement on the surface of the cooling element.
2 more elements
Dependencies are inferred from the claim text.