H05K 7/20772
Within server blades for removing heat from heat source
Official title: {within server blades for removing heat from heat source}
H05K7/20772 (Within server blades for removing heat from heat source) appears on 858 US grants and 1,343 published applications in this corpus.
Search patents in H05K- Granted patents
- 858
- Published applications
- 1,343
- Assignees
- 260
- Inventors
- 1,981
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 3 |
| 2003 | 0 | 0 |
| 2004 | 5 | 2 |
| 2005 | 2 | 12 |
| 2006 | 4 | 7 |
| 2007 | 6 | 16 |
| 2008 | 14 | 17 |
| 2009 | 15 | 10 |
| 2010 | 8 | 17 |
| 2011 | 17 | 11 |
| 2012 | 11 | 16 |
| 2013 | 7 | 29 |
| 2014 | 13 | 46 |
| 2015 | 26 | 35 |
| 2016 | 50 | 44 |
| 2017 | 24 | 42 |
| 2018 | 44 | 45 |
| 2019 | 44 | 54 |
| 2020 | 59 | 56 |
| 2021 | 68 | 67 |
| 2022 | 50 | 136 |
| 2023 | 66 | 104 |
| 2024 | 111 | 160 |
| 2025 | 126 | 194 |
| 2026 | 85 | 220 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Connector, connector assembly, liquid cooled plate, and liquid cooled server6 Oct 2026US 12,753,979 B2Bitmain Technologies Inc.
- Data center cooling system using one or more cooling loops6 Oct 2026US 12,757,358 B1NVIDIA Corporation
- Systems and methods for server level cooling29 Sep 2026US 12,750,982 B2Advanced Micro Devices, Inc.
- Server and server liquid cooling system29 Sep 2026US 12,750,983 B2Inventec Corporation
- Self-aligning connector for liquid cooling of a computing device29 Sep 2026US 12,750,985 B2Quanta Computer Inc.
- Tank assembly8 Oct 2026US 2026/0309171 A1
- Servicing system for server cassettes8 Oct 2026US 2026/0313823 A1
- Liquid-Cooling Cabinet and Structural Layout Method Therefor, and Electronic Device8 Oct 2026US 2026/0313830 A1China Mobile Communications Group Co., Ltd.
- Bidirectional thermal dissipation for enhanced system management8 Oct 2026US 2026/0313833 A1Dell Products L. P.
- Two-stage lever system for a server tray in a server rack8 Oct 2026US 2026/0313834 A1Dell Products L. P.
Most cited
By later US patents
- Method and system for cooling electronics racks using pre-cooled air345US 6,819,563 B1International Business Machines Corporation · 2004
- Hybird cooling system for electronic components245US 5,285,347 ADigital Equipment Corporation · 1994
- Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack151US 7,012,807 B2International Business Machines Corporation · 2006
- Liquid submersion cooling system127US 7,403,392 B2Hardcore Computer, Inc. · 2008
- Case and rack system for liquid submersion cooling of electronic devices connected in an array118US 7,905,106 B2Hardcore Computer, Inc. · 2011