Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

A cooled multi-drawer electronics rack comprising;

• a plurality of electronics drawers, at least one electronics drawer of the plurality of electronics drawers having a thermal dissipation assembly comprising:
• a first liquid cooling subsystem disposed substantially within an electronics drawer and positioned to extract heat from a heat generating component within the electronics drawer, said first liquid cooling subsystem including a first fluid cold plate with a first planar heat transfer surface, the first fluid cold plate being a heat rejection cold plate;
• a second liquid cooling subsystem disposed substantially external to the electronics drawer, said second liquid cooling subsystem including a second fluid cold plate with a second planar heat transfer surface;
• wherein at least one of the first fluid cold plate and the second fluid cold plate moves in a horizontal direction relative to the electronics drawer as the electronics drawer is slid horizontally into a docked position in an electronics rack, and wherein the first planar heat transfer surface of the first fluid cold plate and the second planar heat transfer surface of the second fluid cold plate are each disposed perpendicular to the sliding direction of the electronics drawer as the electronics drawer is slid into the docked position in the electronics rack;
• and
• a spring biasing mechanism for mechanically forcing the at least one moveable first fluid cold plate or second fluid cold plate into physical contact with the other of the first fluid cold plate and the second fluid cold plate with the first planar heat transfer surface and the second planar heat transfer surface engaging when the electronics drawer is in the docked position in the electronics rack to facilitate the transfer of heat from the first liquid cooling subsystem to the second liquid cooling subsystem, and wherein the spring biasing mechanism compresses in the sliding direction as the electronics drawer is slid into the docked position, thereby applying a biasing force against the at least one moveable first fluid cold plate or second fluid cold plate that is perpendicular to the first planar heat transfer surface and the second planar heat transfer surface when the electronics drawer is docked.

A method of fabricating a thermal dissipation assembly for an electronics drawer of an electronics rack, said method comprising:

• providing a first liquid cooling subsystem disposed substantially within the electronics drawer and positioned to extract heat from a heat generating component of the electronics drawer, the first liquid cooling subsystem including a first fluid cold plate with a first planar heat transfer surface, the first fluid cold plate being a heat rejection cold plate;
• disposing external to the electronics drawer, at least partially within the electronics rack, a second liquid cooling subsystem, the second liquid cooling subsystem including a second fluid cold plate with a second planar heat transfer surface;
• wherein at least one of the first fluid cold plate and the second fluid cold plate moves in a horizontal direction relative to the electronics drawer as the electronics drawer is slid horizontally into a docked position in an electronics rack, and wherein the first planar heat transfer surface of the first fluid cold plate and the second planar heat transfer surface of the second fluid cold plate are each disposed perpendicular to the sliding direction of the electronics drawer;
• and
• spring biasing the at least one moveable first fluid cold plate or second fluid cold plate for mechanically forcing the at least one moveable first fluid cold plate or second fluid cold plate into physical contact with the other of the first fluid cold plate and the second fluid cold plate, with the first planar heat transfer surface and the second planar heat transfer surface engaging when the electronics drawer is in the docked position in the electronics rack to facilitate transfer of heat from the first liquid cooling subsystem to the second liquid cooling subsystem, and wherein the spring biasing mechanism compresses in the sliding direction as the electronics drawer is slid into the docked position, thereby applying a biasing force against the at least one moveable first fluid cold plate or second fluid cold plate that is perpendicular to the first planar heat transfer surface and the second planar heat transfer surface when the electronics drawer is docked.