Data center cooling system using one or more cooling loops

A datacenter comprising:

• a room containing one or more servers supported in a datacenter rack;
• and
• a cooling system to cool the one or more servers, the cooling system comprising:
• one or more first cooling loops to cool one or more first components of the one or more servers, wherein the one or more first components have a first power density, at least one first cooling loop of the one or more first cooling loops including a first heat exchanger disposed outside the datacenter and at least two manifolds to distribute a coolant to at least one of the one or more servers, wherein the at least two manifolds are disposed on a same side of the datacenter rack;
• and
• a second cooling loop to cool one or more second components of the one or more servers, wherein the one or more second components have a second power density that is lower than the first power density,
• wherein the at least one first cooling loop flows first coolant from a first manifold of the at least two manifolds and into a first server of the one or more servers in a first direction at a first side wall of the first server at a first horizontal plane and out of the first server in the first direction at a second side wall of the first server opposite the first side wall at the first horizontal plane to a second manifold of the at least two manifolds, and wherein the second cooling loop flows second coolant into the first server in the first direction at the first side wall at a second horizontal plane different from the first horizontal plane and out of the first server in the first direction at the second side wall at the second horizontal plane, wherein the one or more first components are cooled by a series of cold plates associated with the at least one first cooling loop.

A method comprising:

• cooling, via a first cooling loop, one or more first components of a server of a datacenter, wherein the datacenter comprises at least one room containing a plurality of servers supported in a datacenter rack, wherein the one or more first components have a first power density, and wherein the one or more first components are cooled by a series of cold plates associated with the first cooling loop;
• cooling, via a second cooling loop, one or more second components of the server, wherein the one or more second components have a second power density that is lower than the first power density;
• distributing, via at least two manifolds of the first cooling loop, first coolant to the server, wherein the at least two manifolds are disposed on a same side of the datacenter rack, wherein the first cooling loop flows first coolant from a first manifold of the at least two manifolds and into the server in a first direction at a first side wall of the server at a first horizontal plane and out of the server in the first direction at a second side wall of the server opposite the first side wall at the first horizontal plane to a second manifold of the at least two manifolds, and wherein the second cooling loop flows second coolant into the server in the first direction at the first side wall at a second horizontal plane different from the first horizontal plane and out of the server in the first direction at the second side wall at the second horizontal plane;
• and
• exchanging, via a first heat exchanger of the first cooling loop and disposed outside the datacenter, heat from the first cooling loop with an ambient environment.