Two-phase flow manifold and cooling apparatus including the two-phase flow manifold

A cooling apparatus comprising a two-phase manifold, a finned plate, and an interface,

• the two-phase manifold comprising:
• a top level comprising:
• top descending (TD) passages open to at least one inlet in the top level and configured for a liquid inflow;
• top ascending vapor (TAV) passages open to at least one vapor outlet in the top level and configured for a vapor discharge;
• and
• top ascending liquid (TAL) passages open to at least one liquid outlet configured for a liquid discharge, the at least one liquid outlet being in the top level, a first hierarchical level, or a final hierarchical level,
• the first hierarchical level comprising first hierarchical descending (H1D) passages, first hierarchical ascending vapor (H1AV) passages, and first hierarchical ascending liquid (H1AL) passages,
• the final hierarchical level comprising final hierarchical descending (HFD) passages, final hierarchical ascending vapor (HFAV) passages, final hierarchical ascending liquid (HFAL) passages, and a bottom boundary,
• the finned plate comprising a base plate, a microchannel array, and a top boundary, the microchannel array configured to generate the vapor discharge,
• the interface configured to separate the vapor discharge and the liquid discharge, the interface comprising:
• open areas between the top boundary and the HFD passages and the HFAL passages;
• and
• barriers between the top boundary and the HFAV passages, the barriers being gas permeable.