H05K 7/1084
Pin grid array package carriers
Official title: {pin grid array package carriers}
H05K7/1084 (Pin grid array package carriers) appears on 325 US grants and 113 published applications in this corpus.
Search patents in H05K- Granted patents
- 325
- Published applications
- 113
- Assignees
- 113
- Inventors
- 386
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 16 | 0 |
| 1992 | 13 | 0 |
| 1993 | 13 | 0 |
| 1994 | 13 | 0 |
| 1995 | 14 | 0 |
| 1996 | 19 | 0 |
| 1997 | 21 | 0 |
| 1998 | 26 | 0 |
| 1999 | 11 | 0 |
| 2000 | 19 | 0 |
| 2001 | 17 | 2 |
| 2002 | 18 | 8 |
| 2003 | 7 | 13 |
| 2004 | 12 | 12 |
| 2005 | 9 | 4 |
| 2006 | 8 | 6 |
| 2007 | 6 | 3 |
| 2008 | 2 | 11 |
| 2009 | 7 | 10 |
| 2010 | 12 | 7 |
| 2011 | 6 | 2 |
| 2012 | 2 | 4 |
| 2013 | 3 | 1 |
| 2014 | 1 | 3 |
| 2015 | 4 | 1 |
| 2016 | 1 | 1 |
| 2017 | 2 | 0 |
| 2018 | 1 | 3 |
| 2019 | 3 | 7 |
| 2020 | 4 | 4 |
| 2021 | 3 | 2 |
| 2022 | 3 | 6 |
| 2023 | 0 | 2 |
| 2024 | 3 | 0 |
| 2025 | 1 | 1 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Processing apparatus for controlling, measuring and regulating24 Feb 2026US 12,563,678 B2Qlar Europe GmbH
- LGA socket pins for improved differential signaling performance24 Feb 2026US 12,563,686 B2Intel Corporation
- Ejector pin device for chip packaging8 Apr 2025US 12,272,589 B2Chipmore Technology Corporation Limited
- Electronic assembly including cable modules10 Sep 2024US 12,089,357 B2TE Connectivity Solutions GmbH
- Electronic assembly including a compression assembly for cable connector modules26 Mar 2024US 11,943,886 B2TE Connectivity Solutions GmbH
- Anti-misplug guiding module for cpu emulator insertion and alignment27 Nov 2025US 2025/0365879 A1Aivres Systems Inc.
- Lga socket pins for improved differential signaling performance16 Feb 2023US 2023/0046581 A1Intel Corporation
- Electronic assembly including cable modules26 Jan 2023US 2023/0025397 A1TE Connectivity Solutions GmbH
- Ejector pin device for chip packaging3 Nov 2022US 2022/0352003 A1Chipmore Technology Corporation Limited
- Socket alignment and retention system3 Nov 2022US 2022/0354013 A1TE Connectivity Services GmbH
Most cited
By later US patents
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Soldering with resilient contacts217US 5,980,270 ATessera, Inc. · 1999
- Spacer trays for stacking storage trays with integrated circuits189US 5,335,771 AR. H. Murphy Co., Inc. · 1994
- Integrated circuit adapter having gullwing-shaped leads181US 5,151,039 AAdvanced Interconnections Corporation · 1992
- Soldering with resilient contacts176US 5,615,824 ATessera, Inc. · 1997