H05K 5/0211
Thermal buffers
Official title: {Thermal buffers, e.g. latent heat absorbers}
H05K5/0211 (Thermal buffers) appears on 38 US grants and 47 published applications in this corpus.
Search patents in H05K- Granted patents
- 38
- Published applications
- 47
- Assignees
- 33
- Inventors
- 99
- Latest grant
- 7 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 7 | 0 |
| 2002 | 0 | 4 |
| 2003 | 4 | 3 |
| 2004 | 4 | 2 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 1 | 1 |
| 2016 | 0 | 4 |
| 2017 | 2 | 2 |
| 2018 | 3 | 1 |
| 2019 | 2 | 1 |
| 2020 | 1 | 1 |
| 2021 | 0 | 2 |
| 2022 | 1 | 4 |
| 2023 | 2 | 5 |
| 2024 | 4 | 5 |
| 2025 | 4 | 3 |
| 2026 | 0 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heat insulation pad and electronic device with heat insulation pad7 Oct 2025US 12,439,533 B2ASUSTeK COMPUTER INC.
- Wi-Fi hotspot translation mobile phone26 Aug 2025US 12,401,738 B2
- Circuit card assemblies10 Jun 2025US 12,328,847 B2Ametek, Inc.
- Display device having heat dissipation capsules and display terminal having heat dissipation capsules4 Feb 2025US 12,219,860 B2Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Device temperature adjustment10 Dec 2024US 12,167,579 B2Micron Technology, Inc.
- Electronic component cooling assembly25 Jun 2026US 2026/0182377 A1General Electric Company
- Effective Enclosure Surface Features Design to Optimize Touchable Temperature for Power Adapter Devices4 Jun 2026US 2026/0156760 A1Flex Ltd.
- Phase-change cooling systems with electromagnetically induced flow14 May 2026US 2026/0136498 A1Raytheon Company
- Dynamic phase change material for heat removal from electronic devices9 Apr 2026US 2026/0101477 A1Raytheon Company
- Dynamic phase change material for heat removal from electronic devices9 Apr 2026US 2026/0101478 A1Raytheon Company
Most cited
By later US patents
- Temperature controlled airborne electronic assembly29US 4,057,104 AWestinghouse Electric Corp. · 1977
- Phase change material-based data center cooling system17US 9,681,589 B1Amazon Technologies, Inc. · 2017
- Free cooling in high humidity environments15US 9,723,762 B1Amazon Technologies, Inc. · 2017
- Heat absorbing temperature control devices and method12US 6,235,216 B12001
- Heat absorbing temperature control devices and method9US 6,224,784 B12001