Electronic component cooling assembly

An electronic component cooling assembly, comprising:

• an electronic component extending in a longitudinal direction from a first end to a second end, in a transverse direction from a first side to a second side, and a vertical direction from a top side to a bottom side;
• a housing defining a slot such that at least a portion of the electronic component is positioned within the slot, the housing further defining an impingement cooling passage fluidly coupled to the slot;
• a thermal insert positioned between the electronic component and the housing in the vertical direction, the thermal insert defining a chamber such that the impingement cooling passage directs a fluid jet into the chamber and onto the electronic component, the thermal insert further defining a cavity spaced apart from the chamber in at least one of the longitudinal direction or the transverse direction;
• and
• a phase change material positioned within the cavity and configured to absorb heat from the electronic component.