Heat insulation pad and electronic device with heat insulation pad
AssigneeASUSTeK COMPUTER INC.
InventorsYu-Jung Lin, Ing-Jer Chiou, Cheng-Yu Wang
Life of this patent
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Abstract
A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.
Claims11
A heat insulation pad, applied to an electronic device, wherein the electronic device comprises a housing and a heat source, the housing comprises an inner side surface, and the heat insulation pad comprises:
- a first contact layer, adapted to attach to the inner side surface;
- a second contact layer, adapted to contact the heat source;
- and
- a hole layer stack structure, comprising a plurality of hole layers stacked in sequence and located between the first contact layer and the second contact layer,
- wherein both the first contact layer and the second contact layer are polymer layers without holes.
An electronic device, comprising:
- a housing, comprising an inner side surface;
- a heat source, arranged in the housing;
- and
- a heat insulation pad, comprising:
- a first contact layer, adapted to attach to the inner side surface;
- a second contact layer, adapted to contact the heat source;
- and
- a hole layer stack structure, comprising a plurality of hole layers stacked in sequence and located between the first contact layer and the second contact layer,
- wherein both the first contact layer and the second contact layer are polymer layers without holes.
Dependencies are inferred from the claim text.