Circuit card assemblies

A circuit card assembly comprising:

• a circuit board having at least one electronic component that generates heat;
• one or more phase change modules comprising phase change materials for distributing and storing heat;
• a metal frame coupled to the circuit board and in thermal contact with the at least one electronic component, the metal frame further having at least one opening for receiving the one or more phase change modules;
• and
• a heat transfer apparatus in thermal contact with one or more of the at least one electronic component and the metal frame, the heat transfer apparatus providing a first heat transfer path;
• wherein the one or more phase change modules is configured for distributing and storing heat during a period of reduced heat dissipation or cooling;
• and
• wherein the first heat transfer path is provided during the period of reduced heat dissipation or cooling and the first heat transfer path is different from a second heat transfer path during a period of standard steady-state heat dissipation or cooling.

A method of manufacturing a circuit card assembly comprising at least one electronic component that generates heat, the method comprising:

• (a) forming at least one opening in a metal frame for receiving the at least one electronic component;
• (b) forming at least one opening in the metal frame for receiving one or more phase change modules, the one or more phase change modules comprising phase change material for distributing and storing heat;
• (c) filling the at least one opening with the one or more phase change modules;
• (d) attaching a metal layer over the at least one opening for containing the one or more phase change modules within the at least one opening of the metal frame, the one or more phase change modules being configured for distributing and storing heat during a period of reduced heat dissipation or cooling;
• (e) forming at least one groove in the metal frame for contacting a surface of a heat transfer apparatus, such that the heat transfer apparatus is in thermal contact with one or more of the at least one electronic component comprising a printed circuit board and the metal frame, the heat transfer apparatus further providing a first heat transfer path, the first heat transfer path being provided during the period of reduced heat dissipation or cooling and the first heat transfer path being different from a second heat transfer path during a period of standard steady-state heat dissipation or cooling.