Dynamic phase change material for heat removal from electronic devices
AssigneeRaytheon Company
InventorsYasmin Khakpour, Abbas A. Alahyari
Life of this patent
Estimating the term…
Abstract
A system is provided for heat transfer for an electronic device. The system includes a container partially adjacent to the electronic device, phase change material (PCM) at least partially filling the container in solid or liquid form, a spiral actuator disposed in the container with the PCM and a drive element. The drive element is coupled with the spiral actuator and is configured to drive spiral actuator rotation to continuously and repetitively force the PCM in solid form toward the electronic device whereupon electronic device heat liquifies proximal PCM and the PCM in liquid form away from the electronic device for PCM solidification.
Claims20
A system for heat transfer for an electronic device, the system comprising:
- a container partially adjacent to the electronic device;
- phase change material (PCM) at least partially filling the container in solid or liquid form;
- a spiral actuator disposed in the container with the PCM;
- and
- a drive element coupled with the spiral actuator and configured to drive spiral actuator rotation to continuously and repetitively force:
- the PCM in solid form toward the electronic device whereupon electronic device heat liquifies proximal PCM, and
- the PCM in liquid form away from the electronic device for PCM solidification.
A system for heat transfer for an electronic device, the system comprising:
- a container partially adjacent to the electronic device;
- phase change material (PCM) at least partially filling the container in solid or liquid form;
- a single-phase spiral actuator disposed in the container with the PCM;
- and
- a drive element coupled with the single-phase spiral actuator and configured to drive rotation of the single-phase spiral actuator to continuously and repetitively force:
- the PCM in solid form toward the electronic device whereupon electronic device heat liquifies proximal PCM, and
- the PCM in liquid form away from the electronic device for PCM solidification.
A system for heat transfer for an electronic device, the system comprising:
- a container partially adjacent to the electronic device;
- phase change material (PCM) at least partially filling the container in solid or liquid form;
- a dual-phase spiral actuator disposed in the container with the PCM;
- and
- a drive element coupled with the dual-phase spiral actuator and configured to drive rotation of the dual-phase spiral actuator to continuously and repetitively force:
- the PCM in solid form toward the electronic device whereupon electronic device heat liquifies proximal PCM, and
- the PCM in liquid form away from the electronic device for PCM solidification.
Dependencies are inferred from the claim text.