Dynamic phase change material for heat removal from electronic devices
AssigneeRaytheon Company
InventorsYasmin Khakpour, Gary S. Krenzul, Abbas A. Alahyari
Life of this patent
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Abstract
A system is provided for heat transfer for an electronic device. The system includes a container, phase change material (PCM) at least partially filling the container in solid or liquid form, a screw disposed in the container and a drive element. The drive element is coupled with the screw and is configured to drive screw rotation to continuously and repetitively force the PCM in solid form through the container toward the electronic device whereupon electronic device heat liquifies proximal PCM and the PCM in liquid form along an exterior of the container away from the electronic device for PCM solidification.
Claims20
A system for heat transfer for an electronic device, the system comprising:
- a container;
- phase change material (PCM) at least partially filling the container in solid or liquid form;
- a screw disposed in the container;
- and
- a drive element coupled with the screw and configured to drive screw rotation to continuously and repetitively force:
- the PCM in solid form through the container toward the electronic device whereupon electronic device heat liquifies proximal PCM, and
- the PCM in liquid form along an exterior of the container away from the electronic device for PCM solidification.
A system for heat transfer for an electronic device, the system comprising:
- an outer container;
- an inner container disposed within the outer container;
- phase change material (PCM) overfilling the inner container and at least partially filling the outer container in solid or liquid form;
- a screw disposed in the inner container;
- and
- a drive element coupled with the screw and configured to drive screw rotation to continuously and repetitively force:
- the PCM in solid form through the inner container toward the electronic device whereupon electronic device heat liquifies proximal PCM, and
- the PCM in liquid form between the inner and outer containers away from the electronic device for PCM solidification.
A system for heat transfer for an electronic device, the system comprising:
- an outer container, which is cylindrical;
- an inner container, which is cylindrical and disposed within the outer container to define an annular space between the inner and outer containers;
- phase change material (PCM) overfilling the inner container and at least partially filling the outer container in solid or liquid form;
- a screw disposed in the inner container;
- and
- a drive element coupled with the screw and configured to drive screw rotation to continuously and repetitively force:
- the PCM in solid form through the inner container toward the electronic device whereupon electronic device heat liquifies proximal PCM, and
- the PCM in liquid form through the annular space away from the electronic device for PCM solidification.
Dependencies are inferred from the claim text.