H05K 3/101
By casting or moulding of conductive material
Official title: {by casting or moulding of conductive material}
H05K3/101 (By casting or moulding of conductive material) appears on 153 US grants and 204 published applications in this corpus.
Search patents in H05K- Granted patents
- 153
- Published applications
- 204
- Assignees
- 106
- Inventors
- 349
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 6 |
| 2003 | 3 | 2 |
| 2004 | 2 | 20 |
| 2005 | 4 | 48 |
| 2006 | 9 | 10 |
| 2007 | 14 | 6 |
| 2008 | 8 | 4 |
| 2009 | 2 | 8 |
| 2010 | 7 | 8 |
| 2011 | 10 | 7 |
| 2012 | 5 | 4 |
| 2013 | 6 | 4 |
| 2014 | 4 | 8 |
| 2015 | 7 | 15 |
| 2016 | 12 | 6 |
| 2017 | 1 | 4 |
| 2018 | 2 | 0 |
| 2019 | 6 | 12 |
| 2020 | 4 | 1 |
| 2021 | 3 | 6 |
| 2022 | 5 | 10 |
| 2023 | 9 | 3 |
| 2024 | 3 | 6 |
| 2025 | 4 | 3 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Light emitting mirror bezel2 Sep 2025US 12,403,832 B2Motherson Innovations Company Limited
- Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object22 Apr 2025US 12,284,767 B2Fujikura Ltd.
- Deposition with solid feedstock25 Feb 2025US 12,238,870 B2Liquid Wire Inc.
- Aluminum/ceramic bonding substrate and method for producing same11 Feb 2025US 12,221,389 B2Dowa Metaltech Co., Ltd.
- Wiring board and method for manufacturing wiring board3 Dec 2024US 12,160,949 B2FUJIFILM Corporation
- Aluminum/ceramic bonding substrate and method for producing same30 Apr 2026US 2026/0116829 A1Dowa Metaltech Co., Ltd.
- Hybrid mold, method for manufacturing hybrid mold, wiring structure, and method for manufacturing wiring structure30 Apr 2026US 2026/0122788 A1Panasonic Intellectual Property Management Co., Ltd.
- Manufacturing method for a circuit board and circuit board2 Apr 2026US 2026/0096019 A1JCET Management Co., Ltd.
- Method for preparing micro-nano flexible conductive circuit based on ultrasonic driving of liquid metal4 Dec 2025US 2025/0374438 A1Harbin Inst. of Tech (Shenzhen) (Inst. of Science and Tech Innovation, Harbin Inst. of Tech)
- Scalable Fabrication of Microdevices From Metals, Ceramics, and Polymers3 Jul 2025US 2025/0220821 A1Carnegie Mellon University
Most cited
By later US patents
- Stretchable polymer-based electronic device97US 7,337,012 B2Lawrence Livermore National Security, LLC · 2008
- Low cost RFID antenna manufactured from conductive loaded resin-based materials77US 7,017,822 B2Integral Technologies, Inc. · 2006
- Method of fabricating complex micro-circuit boards and substrates62US 4,374,457 A1983
- Conductive member for electric circuit and electric circuit body, and method for fabricating them45US 5,468,918 AYazaki Corporation · 1995
- Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits40US 4,994,215 AFine Particle Technology Corp. · 1991