Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits
AssigneeFine Particle Technology Corp.
InventorRaymond E. Wiech, Jr.
Life of this patent
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Abstract
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.
Claims7
A method of making a substrate comprising the steps of:
- (a) providing a homogeneous composition of sinterable particulate material and binder,
- (b) providing a mold including therein an insert of electrically conductive removable material in a predetermined pattern extending to an interior surface of said mold,
- (c) molding said composition in said mold to the shape of said mold and around said insert,
- (d) passing an electrical current through said insert to heat said insert to melt only the binder portion immediately adjacent said insert,
- (e) removing said insert from said shape to form a continuous aperture in said shape having substantially the geometry of said insert,
- (f) removing at least a portion of said binder from said shape, and
- (g) sintering said shape after said binder removal.
A method of making a substrate comprising the steps of:
- (a) providing a homogeneous composition of sinterable particulate material and binder,
- (b) providing a mold including therein an insert of electrically conductive removable material in a predetermined pattern extending to an interior surface of said mold,
- (c) molding said composition in said mold to the shape of said mold and around said insert,
- (d) removing said shape and insert from said mold,
- (e) passing an electrical current through said insert to heat said insert to melt only the binder portion immediately adjacent said insert,
- (f) removing said insert from said melted portion of said shape to form a continuous aperture in said shape having substantially the geometry of said insert,
- (g) removing at least a portion of said binder from said shape, and
- (h) sintering said shape after said binder removal.
Dependencies are inferred from the claim text.