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US 4,374,457 AGranted
Method of fabricating complex micro-circuit boards and substrates
OwnerRaymond E. Wiech, Jr.inventor
Life of this patent
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Abstract
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in an aperture formed within a substrate and beneath the chips.
Claims28
A method of making a substrate comprising the steps of:
- (a) providing a homogeneous composition formed of particulate material and binder,
- (b) molding said composition to a predetermined shape having a planar surface having portions on said surface wherein heat producing elements will be secured,
- (c) forming a continuous heat sink aperture region of predetermined geometry in said shape in a plane below the said surface of said shape and adjacent the said portions wherein heat producing elements will be secured, said aperture region extending to at least one surface of said shape,
- (d) removing at least a portion of said binder, and
- (e) sintering said shape after said binder removal.
2 more elements
Dependencies are inferred from the claim text.