Aluminum/ceramic bonding substrate and method for producing same
AssigneesDowa Metaltech Co., Ltd., Mitsubishi Electric Corporation
InventorsKoji Kobayashi, Takuma Tsubota, Hideyo Osanai, Daisuke Oya
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Abstract
There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.
Claims9
An aluminum/ceramic bonding substrate comprising:
- a ceramic substrate;
- an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate;
- an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate;
- and
- a plate-shaped reinforcing member having a higher strength than that of the aluminum base plate, the reinforcing member being arranged in the aluminum base plate to be bonded directly to the aluminum base plate, the reinforcing member being a ceramic substrate made of aluminum nitride,
- wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities, and
- wherein said aluminum plate has a surface having an average crystalline particle diameter of not greater than 7 mm.
Dependencies are inferred from the claim text.