H05K 2203/085
Using vacuum or low pressure
H05K2203/085 (Using vacuum or low pressure) appears on 236 US grants and 211 published applications in this corpus.
Search patents in H05K- Granted patents
- 236
- Published applications
- 211
- Assignees
- 187
- Inventors
- 564
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 4 |
| 2002 | 9 | 12 |
| 2003 | 8 | 10 |
| 2004 | 8 | 10 |
| 2005 | 6 | 11 |
| 2006 | 5 | 9 |
| 2007 | 6 | 4 |
| 2008 | 5 | 11 |
| 2009 | 6 | 5 |
| 2010 | 4 | 8 |
| 2011 | 8 | 8 |
| 2012 | 4 | 4 |
| 2013 | 4 | 7 |
| 2014 | 5 | 6 |
| 2015 | 9 | 12 |
| 2016 | 2 | 14 |
| 2017 | 9 | 9 |
| 2018 | 6 | 12 |
| 2019 | 11 | 9 |
| 2020 | 13 | 9 |
| 2021 | 5 | 9 |
| 2022 | 11 | 8 |
| 2023 | 9 | 6 |
| 2024 | 3 | 6 |
| 2025 | 7 | 3 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device and manufacturing method thereof31 Mar 2026US 12,593,399 B2Carux Technology Pte. Ltd.
- Flattening a circuit board assembly using vacuum pressure27 Jan 2026US 12,538,434 B2Teradyne, Inc.
- Circuit board and method of production therefor13 Jan 2026US 12,526,917 B2Denka Company Limited
- Flexible LED vehicle-mounted display screen and production process thereof30 Sep 2025US 12,432,862 B1Shenzhen Juntong Technology Co., Ltd.
- Systems for printing viscous materials using laser assisted deposition23 Sep 2025US 12,420,479 B2Reophotonics, Ltd.
- Method for forming an adhesion buffer layer on the walls of high aspect ratio through-holes of an insulating substrate16 Jul 2026US 2026/0206147 A1Ming Chi University of Technology
- Method for forming an electronic device with reduced warpages16 Apr 2026US 2026/0107375 A1JCET STATS ChipPAC Korea Limited
- Alignment of singulated workpieces5 Mar 2026US 2026/0062232 A1Asmpt Smt Singapore Pte. Ltd.
- Method for producing metal foil-clad laminate, resin composition, resin composite sheet, method for producing printed wiring board, and method for producing semiconductor device12 Feb 2026US 2026/0047004 A1Mitsubishi Gas Chemical Company, Inc.
- Reflow soldering oven22 Jan 2026US 2026/0025932 A1Illinois Tool Works Inc.
Most cited
By later US patents
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Method for manufacturing high-density multilayer printed circuit boards127US 6,119,338 AIndustrial Technology Research Institute · 2000
- Battery mounting apparatuses, electronic devices, and methods of forming electrical connections102US 6,161,281 AMicron Technology, Inc. · 2000
- Method of forming an electronic device having I/O reroute60US 5,673,478 ATexas Instruments Incorporated · 1997