Method for forming an electronic device with reduced warpages

A method for forming an electronic device, the method comprising:

• providing a substrate with at least one electronic component mounted thereon;
• forming a molding layer on the substrate to encapsulate the at least one electronic component;
• curing the molding layer to transform it into a mold cap;
• disposing the substrate with the mold cap onto a carrier having air vents passing therethrough;
• applying laser radiation via a laser source to heat the mold cap and the substrate to a temperature above a predetermined temperature threshold;
• and
• applying, when the temperature of the mold cap and the substrate is above the predetermined temperature threshold, a vacuum pressure to the substrate and the mold cap through the air vents of the carrier such that the substrate and the mold cap are attracted to the carrier to reduce warpage of the mold cap and the substrate generated during the curing step.