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US 5,673,478 AGranted
Method of forming an electronic device having I/O reroute
AssigneeTexas Instruments Incorporated
InventorsGary L. Beene, Robert E. Terrill
Life of this patent
Estimating the term…
Abstract
A method and an apparatus for I/O reroute include the use of reroute traces (16) and overhangs (20). The reroute traces (16) and overhangs (20) are formed using thick film deposition on dies that have been cut from a wafer.
Claims16
A method of forming an electronic device, comprising:
- providing a substrate having a top surface and a side surface, the top surface and the side surface joined at a first edge, the top surface including a top connection area;
- disposing a top conductive thick film trace between the top connection area and the first edge;
- and
- disposing a conductive overhang on the side surface and coupled to the top conductive thick film trace, the step of disposing a conductive overhang including applying a vacuum below the top surface to assist in disposing the conductive overhang on the side surface.
1 more element
A method of forming an electronic device comprising the steps of:
- providing a plurality of substrates, each of said plurality of substrates including a top surface, a bottom surface, and a side surface, said top surface and said side surface joined at a first edge, said bottom surface and said side surface joined at a second edge, said top surface including a top connection area;
- disposing top conductive traces between said top connection areas and said first edges of said substrates;
- coupling conductive overhangs to said top conductive traces and disposing said conductive overhangs on said side surfaces of said substrates by applying vacuum below said top surfaces to assist in disposing said conductive overhangs on said side surfaces;
- forming said plurality of substrates into a stack wherein the top surface of one of said substrates is adjacent the bottom surface of another of said substrates;
- and
- interconnecting a conductive overhang on one of said substrates with a conductive overhang on another of said substrates.
3 more elements
Dependencies are inferred from the claim text.