H05K 2203/0517
Electrographic patterning
H05K2203/0517 (Electrographic patterning) appears on 74 US grants and 70 published applications in this corpus.
Search patents in H05K- Granted patents
- 74
- Published applications
- 70
- Assignees
- 47
- Inventors
- 165
- Latest grant
- 27 Aug 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 3 |
| 2004 | 2 | 2 |
| 2005 | 1 | 11 |
| 2006 | 1 | 6 |
| 2007 | 1 | 8 |
| 2008 | 2 | 7 |
| 2009 | 8 | 12 |
| 2010 | 5 | 4 |
| 2011 | 7 | 5 |
| 2012 | 5 | 1 |
| 2013 | 3 | 1 |
| 2014 | 5 | 0 |
| 2015 | 0 | 3 |
| 2016 | 2 | 1 |
| 2017 | 0 | 0 |
| 2018 | 2 | 1 |
| 2019 | 0 | 2 |
| 2020 | 2 | 2 |
| 2021 | 1 | 0 |
| 2022 | 2 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Circuit board producing apparatus27 Aug 2024US 12,075,569 B2FUJIFILM Business Innovation Corp.
- Method for producing circuit board and method for producing integrated circuit including the same8 Mar 2022US 11,272,622 B2FUJIFILM Business Innovation Corp.
- Metallic pigment particles1 Feb 2022US 11,236,248 B2HP Indigo B. V.
- Method and apparatus for forming on a substrate a pattern of a material21 Dec 2021US 11,206,738 B2HP Indigo B. V.
- Method of producing foil formed member, method of producing wiring substrate, and method of producing integrated circuit1 Dec 2020US 10,852,659 B2Fuji Xerox Co., Ltd.
- Circuit board producing apparatus12 May 2022US 2022/0151077 A1FUJIFILM Business Innovation Corp.
- Method and apparatus for forming on a substrate a pattern of a material21 May 2020US 2020/0163222 A1HP Indigo B. V.
- Method for producing circuit board and circuit board producing apparatus, and method for producing integrated circuit using the same19 Mar 2020US 2020/0093004 A1Fuji Xerox Co., Ltd.
- Method of producing foil formed member, method of producing wiring substrate, and method of producing integrated circuit19 Sep 2019US 2019/0286010 A1Fuji Xerox Co., Ltd.
- Method for solvent-free printing conductors on substrate4 Apr 2019US 2019/0104618 A1
Most cited
By later US patents
- Methods and systems of preparing extended length flexible harnesses38US 5,250,758 AELF Technologies, Inc. · 1993
- Method of forming bump electrode and electronic circuit device35US 4,857,482 AKabushiki Kaisha Toshiba · 1989
- Photoimaging process23US 4,429,027 AE. I. Du Pont de Nemours and Company · 1984
- Electrophoretic imaging metal-toner fluid dispersion23US 4,892,798 AMinnesota Mining and Manufacturing Company · 1990
- Printed circuit board printing system and method using liquid electrophotographic printing23US 7,560,215 B2Hewlett-Packard Development Company, L. P. · 2009