Method of forming bump electrode and electronic circuit device

A method of forming a bump electrode on an electrode terminal of an electronic component including a semiconductor element, comprising the steps of:

• preparing a support having a recess formed in a surface portion thereof, at a position corresponding to said electrode terminal of said electronic part;
• electrically charging said recess of said support, to create static electricity in said recess;
• placing a particulate metal member in said recess, said metal member being retained by way of said static electricity;
• eliminating a charge held wihin said particulate metal member;
• and
• bonding said electrode terminal to said particulate metal member while said electronic component is opposed to said support.

A method of forming a bump electrode on an electrode terminal of an electronic component, comprising the steps of:

• preparing a support having a photoconductive layer formed on a surface portion thereof;
• electrically charging a surface of said photoconductive layer;
• exposing to light an area on the surface of said photoconductive layer, other than an area corresponding to said electrode terminal, to eliminate a charge held in the exposed area;
• placing a particulate metal member on a non-exposed area of the surface of said photoconductive layer, said metal member being retained thereon by way of the static electricity;
• and
• bonding said electrode terminal to said particulate metal member while said electronic component is opposed to said support.

A method of manufacturing an electronic circuit device, comprising the steps of:

• preparing an electronic circuit module having a plurality of electronic parts including a semiconductor element buried in a resin, and electrode terminals formed of a conductive paste and formed on each of electronic component;
• preparing a support having a recess formed on a surface portion thereof, at a position corresponding to said electrode terminal of said electronic circuit module;
• electrically charging said recess of said support, to create static electricity in said recess;
• placing a particulate metal member in said recess, said metal member being retained therein by way of said static electricity;
• bonding said electrode terminal to said particulate metal member while said electronic circuit module is opposed to said support;
• and
• bonding said particulate metal member to an electrode of a printed wiring board to mount said electronic circuit module on said printed wiring board.