Back to results
US 2020/0093004 A1Published application
Method for producing circuit board and circuit board producing apparatus, and method for producing integrated circuit using the same
AssigneeFuji Xerox Co., Ltd.
InventorsYasuo MATSUMURA, Sumiaki YAMASAKI, Tsuyoshi MURAKAMI, Kana YOSHIDA, Shuji SATO
Life of this patent
Estimating the term…
Abstract
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
Claims17
A method for producing a circuit board, comprising:
- providing a substrate on which a toner image formed of a thermoplastic toner has been formed;
- and
- forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
A circuit board producing apparatus comprising:
- a wire forming device that forms a conductive foil layer having a thickness of 0.1 μm to 2 μm on a toner image formed of a thermoplastic toner, the toner image being formed on a substrate, and that applies heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
Dependencies are inferred from the claim text.