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US 11,272,622 B2Granted
Method for producing circuit board and method for producing integrated circuit including the same
AssigneeFUJIFILM Business Innovation Corp.
InventorsYasuo Matsumura, Sumiaki Yamasaki, Tsuyoshi Murakami, Kana Yoshida, Shuji Sato
Life of this patent
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Abstract
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
Claims14
A method for producing a circuit board, comprising:
- providing a substrate;
- forming a toner image on the substrate using a thermoplastic toner, wherein the thermoplastic toner contains toner articles in which a volume ratio of particles having a particle diameter of 16 μm or more is 1% or less relative to a total volume of the toner particles;
- and
- forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the formed toner image on the substrate and simultaneously heating the formed toner image and the conductive foil layer to form a conductive wire constituted by the conductive foil layer.
1 more element
A method for producing an integrated circuit, comprising:
- producing a circuit board, comprising:
- providing a substrate;
- forming a toner image on the substrate using a thermoplastic toner, wherein the thermoplastic toner contains toner particles in which a volume ratio of particles having a particle diameter of 16 μm or more is 1% or less relative to a total volume of the toner particles;
- and
- forming a conductive foil layer having a thickness of 0.1 μM to 2 μm on the formed toner image on the substrate and simultaneously heating the formed toner image and the conductive foil layer to form a conductive wire constituted by the conductive foil layer;
- and
- attaching a semiconductor device to the produced circuit board.
4 more elements
Dependencies are inferred from the claim text.