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US 12,075,569 B2Granted
Circuit board producing apparatus
AssigneeFUJIFILM Business Innovation Corp.
InventorsYasuo Matsumura, Sumiaki Yamasaki, Tsuyoshi Murakami, Kana Yoshida, Shuji Sato
Life of this patent
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Abstract
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
Claims2
A circuit board producing apparatus comprising:
- a wire forming device, including:
- a retention roller that retains conductive foils;
- a conductive foil transfer roller that is arranged obliquely below and directly in contact with the retention roller, said conductive foil transfer roller operatively associated with the retention roller to transfer the conductive foils onto a toner image formed of a thermoplastic toner and formed on a substrate to form a conductive foil layer on the toner image, and
- an opposing roller that is arranged below and opposite to the conductive foil transfer roller, said opposing roller including a heating source configured to apply heat to the toner image of the thermoplastic toner and the conductive foil layer to form a wire constituted by the conductive foils, wherein the conductive foil layer has a thickness in a range of 0.1 μm to 2 μm.
1 more element
Dependencies are inferred from the claim text.