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US 2022/0151077 A1Published application
Circuit board producing apparatus
AssigneeFUJIFILM Business Innovation Corp.
InventorsYasuo MATSUMURA, Sumiaki YAMASAKI, Tsuyoshi MURAKAMI, Kana YOSHIDA, Shuji SATO
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Abstract
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
Claims8
A circuit board producing apparatus comprising:
- a wire forming device that forms a conductive foil layer having a thickness of 0.1 μm to 2 μm on a toner image formed of a thermoplastic toner, the toner image being formed on a substrate, and that applies heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
Dependencies are inferred from the claim text.