H05K 2203/0113
Female die used for patterning or transferring
Official title: Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
H05K2203/0113 (Female die used for patterning or transferring) appears on 373 US grants and 307 published applications in this corpus.
Search patents in H05K- Granted patents
- 373
- Published applications
- 307
- Assignees
- 169
- Inventors
- 802
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 11 | 0 |
| 1994 | 12 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 9 | 0 |
| 1998 | 14 | 0 |
| 1999 | 17 | 0 |
| 2000 | 36 | 0 |
| 2001 | 24 | 10 |
| 2002 | 18 | 20 |
| 2003 | 15 | 18 |
| 2004 | 14 | 30 |
| 2005 | 12 | 54 |
| 2006 | 14 | 18 |
| 2007 | 16 | 25 |
| 2008 | 9 | 31 |
| 2009 | 14 | 36 |
| 2010 | 18 | 12 |
| 2011 | 18 | 9 |
| 2012 | 16 | 6 |
| 2013 | 6 | 6 |
| 2014 | 5 | 5 |
| 2015 | 4 | 3 |
| 2016 | 4 | 3 |
| 2017 | 1 | 4 |
| 2018 | 3 | 1 |
| 2019 | 3 | 0 |
| 2020 | 2 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 8 |
| 2024 | 4 | 5 |
| 2025 | 4 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Donor plate, deposition device and deposition method19 May 2026US 12,635,079 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Method for forming wiring on semiconductor device16 Dec 2025US 12,500,121 B2CONNECTEC JAPAN Corporation
- Transferring viscous materials9 Sep 2025US 12,414,241 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Pattern transfer printing of multi-layered features1 Jul 2025US 12,349,497 B2Wuhan DR Laser Technology Corp,. LTD
- Dynamic pattern transfer printing and pattern transfer sheets with spaced groups of trenches24 Jun 2025US 12,337,608 B2Wuhan DR Laser Technology Corp,. LTD
- Systems and Methods for Shaping Flexible Circuits to Improve Routing and Attachment20 Feb 2025US 2025/0063670 A1Aptiv Technologies AG
- Pattern transfer printing methods for printing ultrafine lines23 Jan 2025US 2025/0031479 A1Wuhan DR Laser Technology Corp,. LTD
- Donor plate, deposition device and deposition method19 Sep 2024US 2024/0314935 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Pattern transfer printing systems and methods27 Jun 2024US 2024/0208242 A1Wuhan DR Laser Technology Corp,. LTD
- A method and device for producing a product comprising a substrate with at least one patterned layer20 Jun 2024US 2024/0206075 A1
Most cited
By later US patents
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Solder bump transfer device for flip chip integrated circuit devices189US 5,607,099 ADelco Electronics Corporation · 1997
- Conductive elastomeric contacts and connectors186US 3,971,610 ATechnical Wire Products, Inc. · 1976
- Apparatus and method for injection molding solder and applications thereof186US 5,244,143 AInternational Business Machines Corporation · 1993