H05K 2201/2009
Reinforced areas
Official title: Reinforced areas, e.g. for a specific part of a flexible printed circuit
H05K2201/2009 (Reinforced areas) appears on 833 US grants and 942 published applications in this corpus.
Search patents in H05K- Granted patents
- 833
- Published applications
- 942
- Assignees
- 471
- Inventors
- 2,207
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 7 | 0 |
| 1990 | 10 | 0 |
| 1991 | 7 | 0 |
| 1992 | 9 | 0 |
| 1993 | 16 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 12 | 0 |
| 1998 | 13 | 0 |
| 1999 | 10 | 0 |
| 2000 | 8 | 0 |
| 2001 | 13 | 5 |
| 2002 | 8 | 11 |
| 2003 | 10 | 22 |
| 2004 | 14 | 28 |
| 2005 | 19 | 25 |
| 2006 | 16 | 39 |
| 2007 | 25 | 35 |
| 2008 | 26 | 45 |
| 2009 | 26 | 42 |
| 2010 | 35 | 50 |
| 2011 | 29 | 29 |
| 2012 | 29 | 23 |
| 2013 | 22 | 31 |
| 2014 | 21 | 41 |
| 2015 | 27 | 36 |
| 2016 | 36 | 39 |
| 2017 | 42 | 24 |
| 2018 | 29 | 26 |
| 2019 | 29 | 44 |
| 2020 | 26 | 39 |
| 2021 | 37 | 54 |
| 2022 | 42 | 44 |
| 2023 | 31 | 38 |
| 2024 | 35 | 30 |
| 2025 | 31 | 32 |
| 2026 | 21 | 110 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Camera module comprising circuit board with lateral connecting belts22 Sep 2026US 12,744,982 B2Ningbo Sunny Opotech Co., Ltd.
- Collapse-free circuit structure with low capacitance effect15 Sep 2026US 12,739,969 B2Unimicron Technology Corp.
- Camera module25 Aug 2026US 12,720,181 B2LG Innotek Co., Ltd.
- Semiconductor package film and manufacturing method thereof11 Aug 2026US 12,707,990 B2Samsung Display Co., Ltd.
- Flat flexible printed circuit21 Jul 2026US 12,690,131 B2Samkee Ev Co., Ltd.
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Electronic device comprising connector13 Aug 2026US 2026/0237927 A1Samsung Electronics Co., Ltd.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
Most cited
By later US patents
- Method for operating a powered articulatable surgical instrument394US 11,291,440 B2Cilag GmbH International · 2022
- Formulation of multichip modules293US 5,239,448 AInternational Business Machines Corporation · 1993
- Foldable electronic assembly module210US 5,224,023 A1993
- Stacked configuration for integrated circuit devices177US 5,117,282 AHarris Corporation · 1992
- Flexible connector for circuit boards161US 5,742,484 AMotorola, Inc. · 1998