H05K 2201/10424
Frame holders
H05K2201/10424 (Frame holders) appears on 530 US grants and 354 published applications in this corpus.
Search patents in H05K- Granted patents
- 530
- Published applications
- 354
- Assignees
- 310
- Inventors
- 1,041
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 6 | 0 |
| 1980 | 6 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 15 | 0 |
| 1988 | 10 | 0 |
| 1989 | 7 | 0 |
| 1990 | 11 | 0 |
| 1991 | 12 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 14 | 0 |
| 1995 | 22 | 0 |
| 1996 | 19 | 0 |
| 1997 | 17 | 0 |
| 1998 | 14 | 0 |
| 1999 | 12 | 0 |
| 2000 | 16 | 0 |
| 2001 | 16 | 8 |
| 2002 | 10 | 4 |
| 2003 | 11 | 22 |
| 2004 | 19 | 17 |
| 2005 | 14 | 28 |
| 2006 | 12 | 10 |
| 2007 | 18 | 21 |
| 2008 | 10 | 22 |
| 2009 | 13 | 37 |
| 2010 | 19 | 17 |
| 2011 | 21 | 11 |
| 2012 | 16 | 7 |
| 2013 | 7 | 8 |
| 2014 | 4 | 16 |
| 2015 | 8 | 9 |
| 2016 | 16 | 8 |
| 2017 | 11 | 10 |
| 2018 | 3 | 15 |
| 2019 | 22 | 12 |
| 2020 | 17 | 18 |
| 2021 | 9 | 13 |
| 2022 | 14 | 9 |
| 2023 | 7 | 13 |
| 2024 | 5 | 7 |
| 2025 | 5 | 4 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Reinforcement structure and electronic device18 Aug 2026US 12,713,927 B2Huawei Technologies Co., Ltd.
- Wire comb with curved arcuate section configured to engage a printed circuit board4 Aug 2026US 12,700,685 B2Vertiv Corporation
- Systems and methods for a power electronics assembly of an imaging system4 Aug 2026US 12,701,681 B2GE Precision Healthcare LLC
- Camera module, control method therefor, and manufacturing method therefor17 Mar 2026US 12,581,175 B2Nippon Chemi-Con Corporation
- Printed circuit board assembly and method for manufacturing printed circuit board assembly10 Mar 2026US 12,575,019 B2Samsung SDI.Co., Ltd.
- Spring array frame and related methods17 Sep 2026US 2026/0282229 A1Bal Seal Engineering, Inc.
- Wiring board, electronic device, and electronic module17 Sep 2026US 2026/0282236 A1KYOCERA Corporation
- Wiring circuit board10 Sep 2026US 2026/0271191 A1Nitto Denko Corporation
- Modular double-sided led display system13 Aug 2026US 2026/0239793 A1
- Motor power module clamping arrangement30 Apr 2026US 2026/0121490 A1Nidec Motor Corporation
Most cited
By later US patents
- Flexible preformed planar structures for interposing between a chip and a substrate242US 5,489,804 ALSI Logic Corporation · 1996
- Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias220US 5,468,681 ALSI Logic Corporation · 1995
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
- Compliant interconnection and method therefor183US 4,642,889 AAMP Incorporated · 1987
- High density connector having a ball type of contact surface166US 6,139,336 ABerg Technology, Inc. · 2000