Printed circuit board assembly and method for manufacturing printed circuit board assembly
AssigneeSamsung SDI Co., Ltd.
InventorWoojin Lee
Life of this patent
Estimating the term…
Abstract
A printed circuit board assembly includes a printed circuit board including a plurality of support holes, a metal frame on which the printed circuit board is supported, and a plurality of bonding portions between the metal frame and the printed circuit board that bond the metal frame and the printed circuit board. The metal frame includes a plate portion opposite the printed circuit board, and a plurality of supports integral with the plate portion, bent and protruding from the plate portion and extending to the printed circuit board, each of the plurality of supports being inserted into each of the plurality of support holes and supporting the printed circuit board.
Claims20
A printed circuit board assembly, comprising:
- a printed circuit board having a plurality of support holes;
- a metal frame supporting the printed circuit board;
- and
- a plurality of bonding portions between the metal frame and the printed circuit board bonding the metal frame and the printed circuit board,
- wherein the metal frame includes:
- a plate portion opposite the printed circuit board;
- and
- a plurality of supports that is:
- integral with the plate portion,
- bent and extending from the plate portion to the printed circuit board,
- inserted into the plurality of support holes, and
- supporting the printed circuit board.
A method for manufacturing a printed circuit board assembly, comprising:
- separating a plurality of supports from a plate portion of a metal frame and bending the plurality of supports from the plate portion to protrude from the plate portion;
- supporting the printed circuit board on the metal frame by inserting the plurality of supports into a plurality of support holes of the printed circuit board;
- and
- bonding the metal frame and the printed circuit board using a plurality of bonding portions between the metal frame and the printed circuit board.
Dependencies are inferred from the claim text.