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US 12,581,175 B2Granted
Camera module, control method therefor, and manufacturing method therefor
AssigneeNippon Chemi-Con Corporation
InventorsKatsuya Tamaki, Masahiro Komiya, Naohisa Shibata
Life of this patent
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Abstract
A camera module includes, for example, a light source, a ToF sensor configured to detect reflected light from a subject that receives light from the light source, and a heat conduction member that conducts heat of the light source to the ToF sensor.
Claims15
A camera module comprising:
- a light source configured to emit light and generate heat;
- a ToF sensor configured to detect reflected light from a subject that receives the light from the light source;
- and
- a heat conduction member that conducts the heat of the light source to the ToF sensor, wherein the heat conduction member includes a first surrounding wall that surrounds the ToF sensor and a heat receiving portion that receives the heat from the light source, and conducts the heat to the ToF sensor.
1 more element
A method for controlling a camera module, comprising:
- emitting light and generating heat by a light source;
- detecting reflected light from a subject by a ToF sensor;
- conducting the heat of the light source to the ToF sensor by a heat conduction member, wherein the heat conduction member includes a first surrounding wall that surrounds the ToF sensor and a heat receiving portion that receives the heat from the light source, and conducts the heat to the ToF sensor;
- detecting a temperature of the ToF sensor or detecting an ambient temperature of the ToF sensor by a temperature sensor;
- and
- controlling, by a control unit, the temperature of the ToF sensor or the ambient temperature of the ToF sensor to a predetermined temperature or a predetermined temperature range by increasing or decreasing a heat generation amount of the light source according to a detection temperature of the temperature sensor.
3 more elements
A method for manufacturing a camera module, comprising:
- forming a heat conduction member including a first surrounding wall for surrounding a ToF sensor and a heat receiving portion for receiving heat of a light source;
- and
- disposing a first circuit board on the first surrounding wall so as to position the ToF sensor in the first surrounding wall, or disposing a second circuit board including rhe light source on the heat receiving portion.
Dependencies are inferred from the claim text.