H05K 2201/10409
Screws
H05K2201/10409 (Screws) appears on 805 US grants and 929 published applications in this corpus.
Search patents in H05K- Granted patents
- 805
- Published applications
- 929
- Assignees
- 492
- Inventors
- 2,215
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 0 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 2 | 0 |
| 1991 | 8 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 9 | 0 |
| 1999 | 7 | 0 |
| 2000 | 10 | 0 |
| 2001 | 8 | 1 |
| 2002 | 9 | 4 |
| 2003 | 6 | 5 |
| 2004 | 10 | 15 |
| 2005 | 6 | 11 |
| 2006 | 8 | 18 |
| 2007 | 8 | 15 |
| 2008 | 13 | 29 |
| 2009 | 12 | 32 |
| 2010 | 17 | 55 |
| 2011 | 21 | 45 |
| 2012 | 29 | 37 |
| 2013 | 36 | 41 |
| 2014 | 16 | 38 |
| 2015 | 32 | 45 |
| 2016 | 31 | 44 |
| 2017 | 41 | 37 |
| 2018 | 52 | 51 |
| 2019 | 59 | 84 |
| 2020 | 74 | 83 |
| 2021 | 58 | 65 |
| 2022 | 57 | 40 |
| 2023 | 37 | 46 |
| 2024 | 35 | 34 |
| 2025 | 33 | 30 |
| 2026 | 15 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Printed circuit board and method of manufacturing the same22 Sep 2026US 12,745,342 B2Rolls-Royce Deutschland Ltd & Co KG
- Printed circuit board thumbscrew locking reinforcement structure21 Jul 2026US 12,690,134 B2AMD Design, LLC
- Package bottom side thermal solution with discrete hat-shaped copper spreader component16 Jun 2026US 12,660,077 B2Intel Corporation
- Self-equalizing frame for thermal management device preload16 Jun 2026US 12,660,143 B2Cisco Technology, Inc.
- Multipurpose coupling mechanism8 Oct 2026US 2026/0313800 A1Mellanox Technologies, Ltd.
- Fixing structure for electronic module and electronic module1 Oct 2026US 2026/0304595 A1Shindengen Electric Manufacturing Co., Ltd.
- Circuit board stiffener and cold plate17 Sep 2026US 2026/0282204 A1Mellanox Technologies, Ltd.
- Printed circuit board assembly10 Sep 2026US 2026/0271174 A1Rolls-Royce Deutschland Ltd & Co KG
- Heat dissipation module, assembling method thereof and electronic device having the same10 Sep 2026US 2026/0271176 A1Delta Electronics, Inc.
Most cited
By later US patents
- Dual-sided heat removal system101US 6,580,611 B1Intel Corporation · 2003
- Capacitor unit100US 7,547,233 B2Panasonic Corporation · 2009
- Transformer assembling method, transformer, transformer-mounted substrate, power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit96US 6,437,673 B1Canon Kabushiki Kaisha · 2002
- Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device90US 5,926,371 AAdvanced Micro Devices, Inc. · 1999
- Illumination assembly and method of making same79US 7,285,802 B23M Innovative Properties Company · 2007