H05K 2201/10287
Metal wires as connectors or conductors
H05K2201/10287 (Metal wires as connectors or conductors) appears on 762 US grants and 694 published applications in this corpus.
Search patents in H05K- Granted patents
- 762
- Published applications
- 694
- Assignees
- 506
- Inventors
- 1,861
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 7 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 7 | 0 |
| 1983 | 5 | 0 |
| 1984 | 8 | 0 |
| 1985 | 17 | 0 |
| 1986 | 9 | 0 |
| 1987 | 8 | 0 |
| 1988 | 7 | 0 |
| 1989 | 15 | 0 |
| 1990 | 4 | 0 |
| 1991 | 8 | 0 |
| 1992 | 8 | 0 |
| 1993 | 6 | 0 |
| 1994 | 11 | 0 |
| 1995 | 13 | 0 |
| 1996 | 11 | 0 |
| 1997 | 5 | 0 |
| 1998 | 11 | 0 |
| 1999 | 9 | 0 |
| 2000 | 13 | 0 |
| 2001 | 11 | 3 |
| 2002 | 16 | 15 |
| 2003 | 7 | 12 |
| 2004 | 13 | 16 |
| 2005 | 10 | 16 |
| 2006 | 7 | 24 |
| 2007 | 19 | 31 |
| 2008 | 8 | 27 |
| 2009 | 18 | 30 |
| 2010 | 26 | 35 |
| 2011 | 23 | 30 |
| 2012 | 25 | 19 |
| 2013 | 14 | 20 |
| 2014 | 14 | 21 |
| 2015 | 26 | 38 |
| 2016 | 28 | 44 |
| 2017 | 38 | 36 |
| 2018 | 38 | 49 |
| 2019 | 46 | 36 |
| 2020 | 38 | 26 |
| 2021 | 22 | 38 |
| 2022 | 29 | 31 |
| 2023 | 20 | 25 |
| 2024 | 26 | 29 |
| 2025 | 26 | 23 |
| 2026 | 14 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transmitter charging module for light detection and ranging (lidar) device22 Sep 2026US 12,745,350 B2Waymo LLC
- Bridge coupling to surface emitters8 Sep 2026US 12,733,090 B2Credo Technology Group Limited
- Fixed equipment, alignment system and method11 Aug 2026US 12,706,427 B2TE Connectivity Services GmbH
- Optical module11 Aug 2026US 12,706,429 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Printed circuit board and semiconductor package including the same11 Aug 2026US 12,707,569 B2Samsung Electronics Co., Ltd.
- Optical receiver8 Oct 2026US 2026/0312695 A1Nippon Telegraph and Telephone Corporation
- Power module and method for manufacturing the same, and power conversion apparatus8 Oct 2026US 2026/0313805 A1Mitsubishi Electric Corporation
- Electronic device and method of manufacturing the same24 Sep 2026US 2026/0292978 A1Advanced Semiconductor Engineering, Inc.
- Electronic equipment3 Sep 2026US 2026/0262166 A1Canon Kabushiki Kaisha
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
Most cited
By later US patents
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Composite elastic and wire fabric for physiological monitoring apparel198US 6,341,504 B12002
- Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards178US 6,464,121 B2Xerox Corporation · 2002
- Method for fabricating semiconductor components with through wire interconnects153US 7,371,676 B2Micron Technology, Inc. · 2008
- Stacked semiconductor component having through wire interconnect145US 7,919,846 B2Micron Technology, Inc. · 2011