H05B 3/0047
For semiconductor manufacture
Official title: {for semiconductor manufacture}
H05B3/0047 (For semiconductor manufacture) appears on 293 US grants and 340 published applications in this corpus.
Search patents in H05B- Granted patents
- 293
- Published applications
- 340
- Assignees
- 118
- Inventors
- 704
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 9 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 3 |
| 2002 | 7 | 4 |
| 2003 | 4 | 6 |
| 2004 | 5 | 6 |
| 2005 | 6 | 4 |
| 2006 | 1 | 3 |
| 2007 | 4 | 1 |
| 2008 | 1 | 9 |
| 2009 | 3 | 2 |
| 2010 | 1 | 6 |
| 2011 | 4 | 4 |
| 2012 | 2 | 1 |
| 2013 | 4 | 8 |
| 2014 | 6 | 22 |
| 2015 | 7 | 26 |
| 2016 | 12 | 26 |
| 2017 | 23 | 21 |
| 2018 | 13 | 20 |
| 2019 | 23 | 14 |
| 2020 | 17 | 17 |
| 2021 | 18 | 24 |
| 2022 | 8 | 28 |
| 2023 | 12 | 17 |
| 2024 | 23 | 31 |
| 2025 | 19 | 24 |
| 2026 | 20 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Susceptor assembly thermal break and methods for cooling a susceptor assembly8 Sep 2026US 12,733,453 B2APPLIED Materials.Inc.
- Multi-zone lamp heating for chemical vapor deposition25 Aug 2026US 12,721,089 B2APPLIED Materials.Inc.
- Axisymmetric heating assembly layout with double ended lamp14 Jul 2026US 12,681,221 B2APPLIED Materials.Inc.
- Apparatus, systems, and methods of measuring edge ring distance for thermal processing chambers14 Jul 2026US 12,685,074 B2APPLIED Materials.Inc.
- Heat treatment susceptor and heat treatment apparatus30 Jun 2026US 12,672,518 B2SCREEN Holdings Co., Ltd.
- Systems and methods for determining when to trigger an abort process during semiconductor fabrication processing24 Sep 2026US 2026/0287676 A1ASM IP Holding B. V.
- Ceramic heater24 Sep 2026US 2026/0292939 A1MiCo Ceramics Ltd.
- Flash irradiation apparatus6 Aug 2026US 2026/0231718 A1Ushio Denki Kabushiki Kaisha
- Substrate Transfer Apparatus and Substrate Transfer Method23 Jul 2026US 2026/0214750 A1Tokyo Electron Limited
- Adjustable mirror arrangements for process chambers, and related methods and apparatus18 Jun 2026US 2026/0173215 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995
- Rapid thermal processing heater technology and method of use202US 5,951,896 AMicro C Technologies, Inc. · 1999
- Rapid thermal processing apparatus for processing semiconductor wafers129US 5,683,518 AMoore Epitaxial, Inc. · 1997
- Semiconductor body heater95US 4,101,759 AGeneral Electric Company · 1978
- Radiant heating apparatus84US 4,533,820 AUshio Denki Kabushiki Kaisha · 1985