H03H 9/0542
Consisting of a lateral arrangement
Official title: {consisting of a lateral arrangement (H03H9/0566 takes precedence)}
H03H9/0542 (Consisting of a lateral arrangement) appears on 532 US grants and 584 published applications in this corpus.
Search patents in H03H- Granted patents
- 532
- Published applications
- 584
- Assignees
- 155
- Inventors
- 985
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 4 |
| 2002 | 7 | 9 |
| 2003 | 10 | 11 |
| 2004 | 8 | 21 |
| 2005 | 10 | 21 |
| 2006 | 14 | 27 |
| 2007 | 21 | 13 |
| 2008 | 11 | 10 |
| 2009 | 19 | 14 |
| 2010 | 9 | 10 |
| 2011 | 17 | 20 |
| 2012 | 11 | 29 |
| 2013 | 15 | 20 |
| 2014 | 16 | 19 |
| 2015 | 22 | 19 |
| 2016 | 19 | 22 |
| 2017 | 17 | 19 |
| 2018 | 22 | 21 |
| 2019 | 24 | 34 |
| 2020 | 31 | 42 |
| 2021 | 25 | 39 |
| 2022 | 27 | 29 |
| 2023 | 31 | 46 |
| 2024 | 31 | 34 |
| 2025 | 31 | 32 |
| 2026 | 22 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Radio-frequency module and communication device16 Jun 2026US 12,658,958 B2Murata Manufacturing Co., Ltd.
- Radio-frequency module and communication device26 May 2026US 12,640,707 B2Murata Manufacturing Co., Ltd.
- Integrated bare die package, and related fabrication methods12 May 2026US 12,628,694 B2QUALCOMM Incorporated
- Acoustic wave device with ceramic substrate20 Aug 2026US 2026/0246444 A1Skyworks Solutions, Inc.
- Integrated devices with multiple acoustic resonator chiplets30 Jul 2026US 2026/0221955 A1QUALCOMM Incorporated
- 3d stacking of multilayer piezoelectric substrate filters and integrated passive devices18 Jun 2026US 2026/0172001 A1Skyworks Solutions, Inc.
- Multi-stack acoustic wave device18 Jun 2026US 2026/0172002 A1Skyworks Solutions, Inc.
- High frequency module and communication device18 Jun 2026US 2026/0172059 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Surface acoustic wave device mounted module473US 5,459,368 AMatsushita Electric Industrial Co., Ltd. · 1995
- Method for manufacturing a vibrating MEMS circuit263US 9,369,105 B1RF Micro Devices, Inc. · 2016
- High frequency chip packages with connecting elements238US 7,176,506 B2Tessera, Inc. · 2007
- Film bulk acoustic wave device154US 5,789,845 AMitsubishi Denki Kabushiki Kaisha · 1998
- Integrated nitride and silicon carbide-based devices125US 7,875,910 B2Cree, Inc. · 2011