3d stacking of multilayer piezoelectric substrate filters and integrated passive devices
AssigneeSkyworks Solutions, Inc.
InventorsBipul Agarwal, Cedric Olivier Gerald Poirel
Life of this patent
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AssigneeSkyworks Solutions, Inc.
InventorsBipul Agarwal, Cedric Olivier Gerald Poirel
Estimating the term…
A multi-stack acoustic wave device is provided that comprises a substrate having one or more first electrodes and one or more second electrodes, a first die having a first portion having one or more electrodes and a second portion positioned away from the first portion, the one or more electrodes of the first die being electrically connected to the one or more first electrodes of the substrate, and a second die having a first portion having one or more electrodes and a second portion positioned away from the first portion, the one or more electrodes of the second die being electrically connected with the one or more second electrodes of the substrate via one or more bonding wires, the first die being positioned between the second die and the substrate, the second portion of the first die being coupled to the second portion of the second die.
A multi-stack acoustic wave device comprising:
A radio-frequency module comprising a multi-stack acoustic wave device having:
A wireless mobile device comprising:
Dependencies are inferred from the claim text.