Radio-frequency module and communication device

A radio-frequency module, comprising:

• a first module substrate including a first major surface and a second major surface that are opposite to each other;
• a second module substrate including a third major surface and a fourth major surface that are opposite to each other, the third major surface being disposed facing the second major surface;
• a plurality of electronic components disposed between the second major surface and the third major surface, on the first major surface, and on the fourth major surface;
• and
• an external connection terminal disposed on the fourth major surface, wherein
• the plurality of electronic components include
• a first electronic component disposed on the first major surface,
• a second electronic component that includes a first electrode joined to the second major surface and a second electrode joined to a third major surface and that is disposed between the second major surface and the third major surface, and
• a third electronic component disposed on the fourth major surface, and
• the second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor, and
• the second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or the external connection terminal.