High frequency module and communication device

A high frequency module comprising:

• a first mounting board having a first major surface and a second major surface opposite to each other;
• a first acoustic wave filter disposed over the first major surface of the first mounting board;
• an external connection terminal disposed on the second major surface of the first mounting board;
• a first bonding conductor disposed between the first major surface of the first mounting board and the first acoustic wave filter;
• and
• a first through-conductor that penetrates the first mounting board in a thickness direction of the first mounting board and is connected to the external connection terminal and the first bonding conductor, wherein
• the first acoustic wave filter has
• a first substrate that has a third major surface and a fourth major surface opposite to each other and includes a piezoelectric body, and
• a first functional electrode disposed on the third major surface of the first substrate,
• the fourth major surface of the first substrate is connected to the first bonding conductor, and
• the first bonding conductor and the first through-conductor overlap with the first functional electrode of the first acoustic wave filter in plan view from the thickness direction of the first mounting board.