H03H 2009/0233
Comprising perforations
Official title: {comprising perforations}
H03H2009/0233 (Comprising perforations) appears on 55 US grants and 48 published applications in this corpus.
Search patents in H03H- Granted patents
- 55
- Published applications
- 48
- Assignees
- 30
- Inventors
- 82
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 2 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 2 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 3 |
| 2010 | 2 | 2 |
| 2011 | 4 | 6 |
| 2012 | 6 | 3 |
| 2013 | 1 | 1 |
| 2014 | 3 | 2 |
| 2015 | 2 | 2 |
| 2016 | 0 | 3 |
| 2017 | 4 | 1 |
| 2018 | 4 | 2 |
| 2019 | 2 | 2 |
| 2020 | 3 | 3 |
| 2021 | 3 | 2 |
| 2022 | 2 | 3 |
| 2023 | 4 | 0 |
| 2024 | 1 | 2 |
| 2025 | 4 | 5 |
| 2026 | 4 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Temperature stable MEMS resonator8 Sep 2026US 12,732,155 B1SiTime Corporation
- Dual resonator structure for oven-controlled MEMS oscillators, including related apparatuses19 May 2026US 12,633,873 B2Microchip Technology Incorporated
- Phononic circuit components24 Mar 2026US 12,586,558 B2The University of Queensland
- MEMS resonator10 Mar 2026US 12,574,002 B2KYOCERA Technologies Oy
- High-quality-factor flexural-vibration resonator for producing time references force sensors or gyrometers16 Dec 2025US 12,498,222 B2Office National D’Etudes Et De Recherches AéRospatiales
- Slanted resonator13 Aug 2026US 2026/0238179 A1KYOCERA Technologies Oy
- Dual-mode mems resonators with low support loss2 Oct 2025US 2025/0309859 A1Panasonic Corporation of North America
- Dual resonator structure for oven-controlled mems oscillators, including related apparatuses6 Mar 2025US 2025/0080050 A1Microchip Technology Incorporated
- Mems resonator27 Feb 2025US 2025/0070745 A1KYOCERA Technologies Oy
- Mems resonator13 Feb 2025US 2025/0055440 A1KYOCERA Technologies Oy
Most cited
By later US patents
- Micro-electromechanical structure resonator, method of making, and method of using47US 6,445,106 B1Intel Corporation · 2002
- Microelectromechanical resonator and method for fabrication38US 7,616,077 B1Sandia Corporation · 2009
- Method for fabricating a microelectromechanical system (MEMS) resonator26US 8,234,774 B2SiTime Corporation · 2012
- Thin-film piezoelectric-on-insulator resonators having perforated resonator bodies therein22US 7,888,843 B2Georgia Tech Research Corporation · 2011
- Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variations17US 7,939,990 B2Integrated Device Technology, Inc. · 2011