H01S 5/02461

Structure or details of the laser chip to manipulate the heat flow

Official title: {Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity}

H01S5/02461 (Structure or details of the laser chip to manipulate the heat flow) appears on 301 US grants and 355 published applications in this corpus.

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Granted patents
301
Published applications
355
Assignees
168
Inventors
720
Latest grant
4 Aug 2026

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H01S 5/02461: granted patents and published applications per publication year
YearGranted patentsPublished applications
198010
198100
198200
198300
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198510
198600
198700
198810
198910
199000
199120
199210
199300
199420
199510
199600
199720
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199900
200000
200102
2002114
2003129
2004169
2005411
2006168
2007613
200889
2009612
2010104
201168
2012114
2013317
20141016
2015189
20161515
20171311
2018917
20191616
20201619
20211128
20221525
20231328
20242419
20251318
20261314

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