H01S 5/024
Arrangements for thermal management
H01S5/024 (Arrangements for thermal management) appears on 2,988 US grants and 3,425 published applications in this corpus.
Search patents in H01S- Granted patents
- 2,988
- Published applications
- 3,425
- Assignees
- 985
- Inventors
- 6,089
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 9 | 0 |
| 1987 | 9 | 0 |
| 1988 | 12 | 0 |
| 1989 | 16 | 0 |
| 1990 | 11 | 0 |
| 1991 | 23 | 0 |
| 1992 | 18 | 0 |
| 1993 | 18 | 0 |
| 1994 | 19 | 0 |
| 1995 | 18 | 0 |
| 1996 | 15 | 0 |
| 1997 | 30 | 0 |
| 1998 | 39 | 0 |
| 1999 | 28 | 0 |
| 2000 | 35 | 0 |
| 2001 | 34 | 21 |
| 2002 | 39 | 89 |
| 2003 | 53 | 112 |
| 2004 | 96 | 92 |
| 2005 | 77 | 128 |
| 2006 | 84 | 112 |
| 2007 | 61 | 120 |
| 2008 | 61 | 103 |
| 2009 | 75 | 105 |
| 2010 | 87 | 70 |
| 2011 | 59 | 99 |
| 2012 | 77 | 83 |
| 2013 | 74 | 110 |
| 2014 | 94 | 122 |
| 2015 | 129 | 139 |
| 2016 | 136 | 168 |
| 2017 | 142 | 157 |
| 2018 | 140 | 186 |
| 2019 | 197 | 192 |
| 2020 | 180 | 230 |
| 2021 | 145 | 218 |
| 2022 | 142 | 204 |
| 2023 | 134 | 195 |
| 2024 | 151 | 147 |
| 2025 | 104 | 120 |
| 2026 | 80 | 103 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01S 5/02407Active cooling1,332
- H01S 5/02469Passive cooling923
- H01S 5/02476Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating741
- H01S 5/02438Characterized by cooling of elements other than the laser chip423
- H01S 5/02461Structure or details of the laser chip to manipulate the heat flow301
- H01S 5/02453Heating199
Recent patents
- Ensemble light source6 Oct 2026US 12,756,150 B1KYOCERA SLD Laser, Inc.
- Systems and methods for cooling high power devices6 Oct 2026US 12,756,154 B2Lawrence Livermore National Security, LLC
- Light emitting element29 Sep 2026US 12,749,868 B2Sony Group Corporation
- Corrosion resistant heatsink method, system, and apparatus22 Sep 2026US 12,744,358 B2nLIGHT, Inc.
- Light-emitting device including semiconductor laser element encapsulated by base and cover with two lead terminals penetrating through lateral wall of base15 Sep 2026US 12,738,710 B2Nichia Corporation
- Multi-wavelength tunable laser8 Oct 2026US 2026/0312366 A1Lumentum Operations LLC
- Red green blue laser module8 Oct 2026US 2026/0312372 A1KYOCERA SLD Laser, Inc.
- Single-ended driver and bidirectional overcurrent protection for a thermoelectric cooler8 Oct 2026US 2026/0312480 A1
- Package for red-green-blue laser diodes1 Oct 2026US 2026/0302719 A1KYOCERA Corporation
- Thermal isolation of laser engines in high density opto-electronic interconnection assemblies1 Oct 2026US 2026/0302723 A1Aayuna Inc.
Most cited
By later US patents
- Semiconductor laser diode controller and laser diode biasing control method229US 5,019,769 AFinisar Corporation · 1991
- Modular microchannel heat exchanger201US 5,727,618 A1998
- Laser diode/lens assembly146US 5,615,052 A1997
- Multiple wavelengths semiconductor laser device131US 7,483,468 B2Kabushiki Kaisha Toshiba · 2009
- Optical illuminator129US 8,675,706 B2Princeton Optronics, Inc. · 2014