H01J 37/32926
Software, data control or modelling
Official title: {Software, data control or modelling}
H01J37/32926 (Software, data control or modelling) appears on 382 US grants and 552 published applications in this corpus.
Search patents in H01J- Granted patents
- 382
- Published applications
- 552
- Assignees
- 89
- Inventors
- 1,029
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 2 |
| 2008 | 0 | 0 |
| 2009 | 0 | 16 |
| 2010 | 0 | 2 |
| 2011 | 5 | 4 |
| 2012 | 10 | 10 |
| 2013 | 4 | 8 |
| 2014 | 9 | 16 |
| 2015 | 14 | 31 |
| 2016 | 22 | 39 |
| 2017 | 28 | 29 |
| 2018 | 29 | 24 |
| 2019 | 30 | 26 |
| 2020 | 26 | 38 |
| 2021 | 22 | 42 |
| 2022 | 25 | 35 |
| 2023 | 24 | 68 |
| 2024 | 43 | 55 |
| 2025 | 56 | 65 |
| 2026 | 35 | 42 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Plasma processing apparatus and gas exhaust method6 Oct 2026US 12,755,945 B2Hitachi High-Tech Corporation
- Signal processing system and power supply device having a signal processing system15 Sep 2026US 12,738,466 B2TRUMPF Huettinger GmbH + Co. KG
- Smart dynamic load simulator for RF power delivery control system25 Aug 2026US 12,719,021 B2APPLIED Materials.Inc.
- Non-invasive measurement of plasma systems25 Aug 2026US 12,719,034 B2Dublin City University
- Plasma apparatus18 Aug 2026US 12,712,154 B2Postech Research and Business Development Foundation
- Recipe transfer of plasma process using plasma parameters determined by virtual metrology (vm) feature selection17 Sep 2026US 2026/0277114 A1Tokyo Electron Limited
- Plasma measurement method and plasma measurement system17 Sep 2026US 2026/0279747 A1Tokyo Electron Limited
- Method for prediction of ion energy distribution in plasma process20 Aug 2026US 2026/0245843 A1Tokyo Electron Limited
- Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials13 Aug 2026US 2026/0237607 A1Lam Research Corporation
- Machine vision-based showerhead inspection6 Aug 2026US 2026/0228879 A1Lam Research Corporation
Most cited
By later US patents
- In situ oxidation of subsurface formations122US 7,866,386 B2Shell Oil Company · 2011
- System, method and apparatus for RF power compensation in a plasma processing system119US 9,508,529 B2Lam Research Corporation · 2016
- Systems and methods for calibrating a switched mode ion energy distribution system102US 9,210,790 B2Advanced Energy Industries, Inc. · 2015
- High temperature methods for forming oxidizer fuel97US 7,866,388 B2Shell Oil Company · 2011
- Ranging methods for developing wellbores in subsurface formations87US 8,011,451 B2Shell Oil Company · 2011