H01J 2237/3344
Isotropy
Official title: isotropy
H01J2237/3344 (Isotropy) appears on 75 US grants and 92 published applications in this corpus.
Search patents in H01J- Granted patents
- 75
- Published applications
- 92
- Assignees
- 35
- Inventors
- 220
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 2 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 3 |
| 2011 | 1 | 1 |
| 2012 | 1 | 1 |
| 2013 | 2 | 1 |
| 2014 | 2 | 4 |
| 2015 | 1 | 3 |
| 2016 | 3 | 9 |
| 2017 | 3 | 6 |
| 2018 | 3 | 10 |
| 2019 | 7 | 10 |
| 2020 | 9 | 12 |
| 2021 | 5 | 7 |
| 2022 | 9 | 4 |
| 2023 | 3 | 5 |
| 2024 | 3 | 7 |
| 2025 | 6 | 2 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method for processing substrate using plasma11 Aug 2026US 12,706,279 B2Semes Co., Ltd.
- Method for ion-assisted self-limited conformal etch23 Jun 2026US 12,666,892 B2Tokyo Electron Limited
- Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium17 Mar 2026US 12,581,882 B2Kokusai Electric Corporation
- Symmetric plasma process chamber17 Feb 2026US 12,555,748 B2APPLIED Materials.Inc.
- Plasma processing apparatus14 Oct 2025US 12,444,582 B2Hitachi High-Tech Corporation
- Method of plasma etching11 Jun 2026US 2026/0165052 A1SPTS Technologies Limited
- Symmetric plasma process chamber4 Jun 2026US 2026/0155336 A1APPLIED Materials.Inc.
- Plasma processing apparatus27 Nov 2025US 2025/0364212 A1Tokyo Electron Limited
- Plasma uniformity control system and methods10 Jul 2025US 2025/0226178 A1APPLIED Materials.Inc.
- Method for ion-assisted self-limited conformal etch14 Nov 2024US 2024/0379372 A1Tokyo Electron Limited
Most cited
By later US patents
- Symmetric plasma process chamber389US 9,741,546 B2APPLIED Materials.Inc. · 2017
- Dry etching method82US 4,233,109 AZaidan Hojin Handotai Kenkyu Shinkokai · 1980
- Plasma processing apparatus and method75US 8,603,293 B2Tokyo Electron Limited · 2013
- Plasma processing apparatus and method58US 7,988,816 B2Tokyo Electron Limited · 2011
- Plasma etch isotropy control53US 4,889,588 ATegal Corporation · 1989